APEC exhibits span power components to high-voltage probes
At APEC 2017 March 26-30 in Tampa, FL, attendees focused on various aspects of power-electronics technology. Participants reported a variety of innovations, including a fiber-optic high-voltage probe, a solar-array simulation tool, current waveform analyzers, a cooling system, inductors and capacitors, component-selection software, wireless charging coils, and power semiconductors.
Instruments and equipment
A spokesperson for Teledyne LeCroy said the company’s HVFO high-voltage fiber-optic probe (Figure 1) was a popular attraction at APEC—commenting that the probe is suitable for measuring upper-side gate drive signals, floating control signals, or floating sensor signals. It was previewed last September at the IEEE Energy Conversion Congress and Expo 2016 in Milwaukee, WI.
Courtesy of Teledyne LeCroy
The HVFO measures small signals floating on a high-voltage bus in power electronics designs. Optical isolation between the probe tip and the oscilloscope input reduces adverse loading of the DUT and reduces noise, distortion, ringing, overshoots, and transients on
the measured signal. The spokesperson said it surpasses the measurement capabilities and signal fidelity of both conventional high-voltage differential probes and acquisition systems that rely on galvanic channel-to-channel and channel-to-ground high-voltage isolation. Furthermore, it mitigates reliance on dangerous test setups that require floating the oscilloscope and probe.
The HVFO architecture incorporates a single laser and fiber-optic cable providing optical isolation and modulated signal plus data communication.
Keysight Technologies demonstrated its latest array of design and test solutions that help engineers solve today’s most challenging power electronics problems ranging from design and test through manufacturing and final test. Keysight demonstrated photovoltaic/solar array simulation solutions offering automated static and dynamic maximum peak power tracking tests; power efficiency and analysis tools, such as the CX3324A device current waveform analyzer allowing simultaneous current waveform measurements of two or more channels; converter design and simulation solutions designed to save time and money during the design and test phases; and additional design and test solutions designed to drive greater efficiency and performance for new power electronics.
In addition, Advanced Cooling Technologies highlighted a new high-performance power electronics cooler. Tests have shown the new coolers are capable of passively transferring more than 11 kW of waste heat with no power, no noise, and no moving parts. The coolers utilize thermosyphon technology, which can move large amounts of waste heat efficiently.
Components
Coilcraft previewed its new power-inductor selection tool (Figure 2). Users are offered four paths depending on whether they need inductors for a known converter topology, a specific IC they want to use, an existing set of inductor specifications, or a comparison of the inductors they have already chosen. Regardless of which path they take, the tool provides a list of off-the-shelf inductors that meet the defined specifications.
Courtesy of Coilcraft
The user experience of the new tool has been enhanced with the capability to move and delete columns, adjust the ambient temperature for dynamic results, and filter parts by core material, part mounting configuration, shielding, and AEC qualification.
AVX highlighted its new FHC1 and FHC2 Series power film capacitors (Figure 3), which were designed for electric and hybrid electric vehicle (EV/HEV) applications. Exhibiting high ripple current capabilities, extremely high dielectric strength in operating conditions up to 115°C, low inductance, low ESR, and a low thermal footprint, the new FHC Series capacitors deliver high-reliability performance that compliments and protects high-power-density inverter products. Engineered for use in the DC-link circuits between EV/HEV rectifiers and inverters, FHC Series capacitors smooth and filter current and voltage variations and prevent ripple currents from reaching and damaging the power source, which makes them suitable for use in conjunction with EV and HEV IGBT modules as well as medium-sized motor drives.
Courtesy of AVX
“We’re pleased to announce the release of our latest power film products at APEC,” said John Gallipeau, technical marketing manager, power film capacitors, AVX, in a press release. “This conference is widely recognized as the premier annual event in applied power electronics, so we’re very proud to be here promoting many of the advanced component contributions we’ve made to this market. AVX is committed to the continued development of innovative component technologies that—like our new FHC1 and FHC2 Series power film capacitors—are engineered to enable next-generation power electronics in markets including automotive, industrial, medical, MIL/Aero, consumer, communications, and alternative energy.”
Würth Electronics highlighted its wireless charging coils, which now are featured in Semtech’s LinkCharge 20 inductive wireless charging system delivering greater than 15 W.
“LinkCharge 20 addresses the need for a wireless charging solution that can support high-power applications,” said Ruwanga Dassanayake, product line manager for Semtech’s Power and High-Reliability Products Group, in a press release. “Our diverse portfolio of wireless charging devices can accommodate low-, medium-, and high-power devices to help scale wireless charging integration into everyday consumer electronics to industrial equipment and more.”
The transmitter coils, 760308103102 and 760308110, featured in Semtech’s LinkCharge 20, are part of a series of high-efficiency wireless charging coils offered by Würth Electronics. The LinkCharge 20 system is suitable for high-power industrial applications such as power tools, appliances, medical instruments, and automation systems.
Semiconductors
Fabless power-semiconductor company Helix Semiconductors launched the first in a series of products designed to eliminate energy waste worldwide. The new eMpower HS100 is a two-chip set that brings conversion efficiency of more than 95% when converting AC mains voltage to 5 VDC—especially at light load, no load, or standby operating conditions. At full loads, the eMpower HS100 enables efficiency of greater than 93%.
Based on Helix Semiconductors’ patented MuxCapacitor voltage-reduction technology, the eMpower HS100 converts North American (120 VAC) or Japanese (90 VAC) mains to 5 VDC at 10 W and European (240 VAC) mains to 5 VDC at 5 W. Output voltage regulation is ±5%.
The company said industry leaders have set an aggressive target for power consumed by electronic appliances when in an inactive, or standby, mode. Dubbed “Zero Power,” the goal is specified as less than or equal to 5 mW. Systems implementing the eMpower HS100 device are approaching the “Zero Power” goal, Helix said.
ON Semiconductor launched the FDMF8811, which the company calls the industry’s first 100-V bridge power stage module for half-bridge and full-bridge isolated DC/DC converters. The 25-A device integrates a 120-V driver IC, a bootstrap diode, and two power MOSFETs in a PQFN-36 package.
The FDMF8811 reduces the board area required for DC/DC converter designs by approximately one-third compared with discrete implementations, the company said, enabling engineers to design smaller systems. If space is not a concern, the FDMF8811 also enables increased power delivery within the existing available board area.
By integrating all of the key power components, ON Semiconductor said it has optimized the design with regard to driver and MOSFET dynamic performance, system parasitic inductance, and power MOSFET RDS(ON), thereby maintaining high efficiency. The FDMF8811 delivers system efficiencies in excess of 97% in full-bridge 600 W applications.
“The FDMF8811 opens a new product category in the market,” commented Roberto Guerrero, senior director of marketing, Cloud Power Solutions at ON Semiconductor, in a press release. “It enables higher levels of power density in isolated DC/DC converters in the cloud infrastructure.”
In addition, Littelfuse and Monolith Semiconductor, a Texas-based startup developing silicon-carbide technology, offered in-booth demonstrations of new technology platforms for products nearing introduction, a professional education seminar, and lectures in sessions devoted to power device reliability and industrial power applications of silicon carbide semiconductors.
Littelfuse said it would present the first commercially available silicon-carbide devices developed through its partnership with Monolith at the PCIM (Power Conversion and Intelligent Motion) Europe 2017 conference May 16-18 in Nuremberg, Germany. Those devices include the new GEN2 Series 1,200-V SiC Schottky diodes. The companies said it also would preview its next technology platform for the power semiconductor market, a line of 1,200-V SiC MOSFETs.
