Hirose board-to-board connector features floating structure
Chicago, IL. Hirose has launched an SMT board-to-board connector that utilizes a unique 3-piece floating contact system to simplify assembly and support high-speed transmission capability up to 15-Gb/s. Designed for high-speed transmission applications that require multiple stacking connectors on the same PCB, the 0.5-mm pitch FX10-3 Series connector is the latest addition to Hirose’s FunctionMax family.
The 3-piece connector utilizes a new design that connects ground pins inside the connector with ground bars. This ground connection design lowers crosstalk, thus improving the insertion-loss to crosstalk ratio and increasing transmission speed capability.
“Featuring a new, patent-pending 3-piece floating concept that provides smooth contact movement, the FX10-3 Series mezzanine connector saves assembly time and costs when mating multiple connectors on the same printed circuit board. The 3-piece design also offers excellent signal integrity characteristics to deliver 15-Gb/s transmission required in high-speed applications,” said Bill Kysiak, product marketing manager for Hirose Electric USA.
Available in 120, 144, and 168 positions, the FX10-3 Series has a stacking height range of 8 to 13 mm with 1-mm increments. Three types of interposers are offered: two that have grounding options with differential impedance values of 100 Ω and 85 Ω and one interposer that does not provide grounding for all types of signals.
The FX10-3 Series is RoHS-compliant, with an operating temperature range of -55°C to +85°C, a rated voltage of 50 VAC, a rated contact resistance of 130 mΩ, and an insulation resistance of 100 MΩ minimum at 100 VDC.
The FX10-3 Series has already been used in high-speed transmission applications including base-station transceivers, medical equipment, office imaging equipment, industrial machinery, and servers.