Harrisburg, PA. TE Connectivity (TE) has introduced its new extra-large array (XLA) socket technology, which provides more reliable performance with 78% better warpage control than traditional molded-socket technologies, the company reported. The XLA socket technology allows TE to design enhanced sockets to support high data speeds in next-generation datacenters.
The utilization of printed circuit board (PCB) substrates versus other plastic materials results in minimal warpage and enables TE to design what it calls the industry’s largest one-piece socket with sizes up to 110 mm x 110 mm and a 10,000+ position count capability. Because of such large capacity, these sockets are capable of fast data rates up to 56 Gb/s.
“TE’s XLA socket technology provides the ability to scale to extremely high pin counts, staying ahead of market demand for next-generation switches and servers,” said Erin Byrne, vice president, engineering, and chief technical officer for Data & Devices at TE Connectivity. “The XLA socket will enable the expansion in scale and performance needed for future high-performance computing and processing.”
XLA socket technology also offers 33% improved true position on the solder ball and contact as well as low coefficient of thermal expansion (CTE) mismatch to motherboard, and it mitigates SMT risks during customer application. Two versions are available: the hybrid land-grid array/ball-grid array (LGA/BGA) and the dual-compression LGA/BGA.
To learn more about TE’s new XLA socket technology, click here.