Bannockburn, IL. IPC-Association Connecting Electronics Industries is inviting researchers, technical experts, and industry leaders to submit abstracts for poster presentations at IPC Apex Expo, the industry conference and exhibition for printed-board design and manufacturing as well as electronics assembly and test. Poster presentations are scheduled for Wednesday, January 30, 2019, and will be displayed throughout the event, January 29-31 in San Diego, offering additional visibility.

Technical poster presentations are being sought on all relevant electronics topics, including design, materials, assembly, processes, and equipment and test:

• 5D/3D component packaging
• 3D printing in electronics manufacturing
• automation in electronics manufacturing
• advanced technology
• area array/flip chip/0201 metric
• assembly and rework processes
• BGA/CSP packaging
• BTC/QFN/LGA/MLF components
• business and supply chain issues
• counterfeit electronics
• design
• electromigration
• electronics manufacturing services
• embedded passive and active devices
• environmental compliance
• graphene in electronics manufacturing
• LED manufacturing
• failure analysis
• flexible circuitry
• HDI technologies
• board and component warpage
• high speed, high frequency, and signal integrity
• Industry 4.0
• lead-free fabrication, assembly, and reliability
• nanotechnology
• optoelectronics
• packaging and components
• PCB fabrication
• quality and reliability
• photovoltaics
• PoP (package-on-package)
• printed electronics
• reshoring
• RFID circuitry
• robotics
• soldering
• test and inspection
• wearables

An abstract of up to 300 words summarizing technical and previously unpublished work covering case histories, research, and discoveries should be submitted by Friday, September 21, 2018, to www.IPCAPEXEXPO.org/CFPosters.