Bannockburn, IL. IPC-Association Connecting Electronics Industries is inviting researchers, technical experts, and industry leaders to submit abstracts for poster presentations at IPC Apex Expo, the industry conference and exhibition for printed-board design and manufacturing as well as electronics assembly and test. Poster presentations are scheduled for Wednesday, January 30, 2019, and will be displayed throughout the event, January 29-31 in San Diego, offering additional visibility.
Technical poster presentations are being sought on all relevant electronics topics, including design, materials, assembly, processes, and equipment and test:
- 5D/3D component packaging
- 3D printing in electronics manufacturing
- automation in electronics manufacturing
- advanced technology
- area array/flip chip/0201 metric
- assembly and rework processes
- BGA/CSP packaging
- BTC/QFN/LGA/MLF components
- business and supply chain issues
- counterfeit electronics
- design
- electromigration
- electronics manufacturing services
- embedded passive and active devices
- environmental compliance
- graphene in electronics manufacturing
- LED manufacturing
- failure analysis
- flexible circuitry
- HDI technologies
- board and component warpage
- high speed, high frequency, and signal integrity
- Industry 4.0
- lead-free fabrication, assembly, and reliability
- nanotechnology
- optoelectronics
- packaging and components
- PCB fabrication
- quality and reliability
- photovoltaics
- PoP (package-on-package)
- printed electronics
- reshoring
- RFID circuitry
- robotics
- soldering
- test and inspection
- wearables
An abstract of up to 300 words summarizing technical and previously unpublished work covering case histories, research, and discoveries should be submitted by Friday, September 21, 2018, to www.IPCAPEXEXPO.org/CFPosters.