Test system for multilayer ceramic capacitors
The new Allegro LC test system is designed to address the high-level testing of larger multilayer ceramic capacitors (MLCCs) used increasingly in rapidlygrowing applications, including handheld, IoT, and automotive products. The Allegro LC tests up to 1.2 million components per hour for chip sizes up to 1210 (3225 metric). The Allegro LC system provides production-oriented testing and sorting of MLCC ranging from 0603 (1608 metric) to 1210 (3225 metric). Its easy reconfigurability contributes to throughput gains by minimizing set-up time for production changes. The system also supports the control and monitoring of multiple networked systems through a local host, using ESI Control Center software. Electro Scientific Industries, Inc.
Stamped spring pin socket for 0.8mm pitch Infineon LFBGA
A new socket addresses high-performance requirements for burn-in and test applications: the SBT-BGA-6553. The contactor is a stamped spring pin with 31Voice coil positioning stage
The VCS13-108-LB-01-MCF voice coil positioning stage uses the voice coil motor NCC13-30-108-1SH to generate a continuous/peak force of 10.8 lbs [48.0 N]/32.4 lbs [144 N] with a total stroke length of 1.3 in [31.8 mm]. TheHigh-speed, direct-drive linear motor with integrated encoder
This vendor has added a new linear motor to its SDLM Series of high-speed, direct-drive linear motors. The SDLM-051-095-01-05 is a powerful, compactlinear actuator measuring 2.00 in. (50.8 mm) in diameter and 3.75 in. (95.3 mm) long. It has a 1.0 in. (25.4 mm) stroke and features a resolution of 5 microns (0.000197 in.). The integral, linear optical quadrature encoder is directly connected to the shaft for the greatest possible bandwidth and accuracy and is protected by the housing. This fully enclosed linear motor features a continuous force rating of 7.6 lbs (33.9 N) and a peak force of 24.1 lbs. (107.2 N) at 10% duty cycle. Applications Include: vibration, noise cancelation, photonics, gimbals, antenna positioning, medical devices, semiconductor handling, SMT machines, assembly, wafer handling, optical focusing, dynamic vibration absorption, scanners, and laser beam steering. The non-commutating SDLM-051-095-01-05 with 5 micron resolution direct-drive linear motor has a quiet, long-life plain linear bearing, nonrotating shaft, predrilled and tapped mounting holes, and threaded (internal) ends of the shaft for easy integration into new and existing applications. These low-cost direct drive actuators or electric cylinders are coupled directly to the load providing high acceleration and high speed with zero cogging and the zero backlashes. They are a low-cost alternative to pneumatic and hydraulic actuators. The SDLM-025-095-01-05 is also available with a complete plug-and-play matching motion controller. Moticont
RF coaxial spring probes for high-frequency test
The CSP-40A-024 and CSP-40G-021 radio high frequency test probes are designed to mate to a variety of industry standard connectors such as MMCX, Fakra, SMB, and U.FL. Made for the PCBA test market, they combine proven RF2.5 kV high-voltage module
A brand-new high-voltage module enables users to quickly and easily insert four high-voltage contacts in a space-saving carrier without the use of tools,Harsh media-compatible pressure transducers
The MP Series of harsh-media-compatible pressure transducers uses proprietary DURAsense unique packaging and microelectromechanical systems (MEMS) pressure sensor integration strategy with a hermetically sealed pressure fitting at a low cost while eliminating the troublesome and highlyunreliable “O-ring” popularly used to seal the sensing element from its measured media. They are suitable for applications including HVAC, heat pumps, compressors, hydraulics, off-road vehicles, and industrial equipment. The MP Series is comprised of a ceramic substrate, on which the MEMS piezo resistive pressure sensor is hermetically attached. The design utilizes a media compatible rear-entry packaging strategy for media contact with the Silicon sensor, thus eliminating the contact of bond wires and electrical signals to the media, which also enhances reliability and the ability to operate in conductive media. This approach significantly enables optimized sensor chip performance at reduced cost and with a high level of reliability. Additionally, this packaging approach provides improved reliability and performance at a lower price over pressure sensors that use an oil-filled cavity and a metallic diaphragm. The pressure sensor ceramic is hermetically bonded to the pressure fitting, which gives the series enhanced ruggedness and reliability and avoids O-ring problems due to incompatible materials. Signal conditioning for the pressure measurement and performance compensation is provided by an Application Specific Integrated Circuit (ASIC) mounted on a PCB. DunAn Sensing