Test & Measurement: Socket Tester Runs Interconnect Tests On 200-Pin DIMMs

Aug. 9, 2004

Designers encounter many obstacles when using boundary-scan techniques to test sockets. The ScanDIMM-S0200 intelligent socket tester overcomes those problems, performing advanced interconnect tests on 200-pin double-data-rate small-outline dual-inline memory modules (DDR SO DIMMs). Inserting the tester into a DIMM socket on the unit under test places a fully bidirectional boundary-scan cell behind each pin of the DIMM connector. This increases test coverage from data and address signal pins to clock, control, and all power and ground pins. The tester is fully compatible with the company's ScanPlus software, and it comes complete with all necessary cabling. Available from stock, it's priced at $895.

Corelis Inc.www.corelis.com;
(562) 926-6727

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.