The Gap Pad 2500 line of brown stick-on thermal pads, designed for mid- to high-performance applications, features 2.7 W/m-K of thermal conductivity. The soft and compliant resin formation pads are available in standard sheet sizes of 8- by 16-in., 20- to 125-mil thick die cuts of many different sizes and shapes, as well as in custom sizes.
Consisting of a nonreinforced gap-filling material, the pads don't crumble, flake, tear, or come apart. They're also easy to apply and pull off a product. The pads are 0.020 in. thick with tackiness available on either one or both surfaces. So, a single pad can be used for multiple heat-generating components that may be stacked. Other standard thicknesses include 0.040, 0.060, 0.080, 0.100, and 0.125 in.
The pads feature heat capacity of 1 j/g-K, a density of 3.1 g/cc, and a continuous-use temperature of −76°F to 392°F. They can handle a dielectric breakdown of more than 6000 V ac. Also, they have a dielectric constant of 6.8 (at 1 kHz), volume resistivity of 1011 (omega)-m, and a Young's modulus rating of 113.
Typical applications include heat transfer for game stations, mass-storage drives, graphics cards and processors, wireless and wired communications hardware, and automotive power-train controls.
Based on 5000-unit quantities, pricing is $0.58 for a sheet with dimensions of 1 by 1 by 0.20 in. High-volume discounts are available.
Bergquist Co. www.bergquistcompany.com (800) 347-4572