Providing high levels of protection in the handling and shipping of sensitive electronic components, WafflePack chip trays are well-suited for carrying devices such as bare and bumped die, CSPs, fine pitch BGAs and other precision components.
Providing high levels of protection in the handling and shipping of sensitive electronic components, WafflePack chip trays are well-suited for carrying devices such as bare and bumped die, CSPs, fine pitch BGAs and other precision components. Available in 2" x 2" and 4" x 4" standard tray sizes, WafflePack trays are made from a high-grade polycarbonate polymer and offer a 125°C bake temperature tolerance and excellent ESD properties. The trays are also said to offer superior dimensional stability and structural rigidity.
Company:ITW ELECTRONIC COMPONENT PACKAGING SYSTEMS
