The EP21FL two-part epoxy-resin system features low to moderate viscosity and is suitable for potting, coating, and sealing electronic assemblies. It is said to excel at bonding dissimilar substrates with different coefficients of expansion. Features include a service temperature range of -60ºF to +250ºF, typical viscosity of Part A is 4,000 cps at 25ºC and 10,000 cps at 25ºC for Part B, bond strength is generally greater than 1,500 psi, and tensile strength normally exceeds 1,100 psi. MASTER BOND INC., Hackensack, NJ. (201) 343-8983.
