Quality Tester Automates Assessment of Semi Package Thermal Structure

The Simcenter Micred Quality Tester from Siemens enables the assessment of a semiconductor package's thermal structure to identify manufacturing defects, including die-attach issues.

Alix Paultre

Related To:

Electronic Design

May 24, 2022

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With the Simcenter Micred Quality Tester from Siemens, engineers can assess a semiconductor package's thermal structure to identify manufacturing defects, including die-attach issues. Precise measurement of thermal response to a short power pulse allows for high-throughput semiconductor testing, including junction-to-case thermal-resistance verification.

Junction temperature measurement is performed via an electrical method using built-in Simcenter Micred T3STER technology. As an IC test handler picks and places devices for test, each device is qualified for automated binning compared to a gold standard thermal-impedance curve and preset bandings of variation.

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About the Author

Alix Paultre

Editor-at-Large, Electronic Design

An Army veteran, Alix Paultre was a signals intelligence soldier on the East/West German border in the early ‘80s, and eventually wound up helping launch and run a publication on consumer electronics for the US military stationed in Europe. Alix first began in this industry in 1998 at Electronic Products magazine, and since then has worked for a variety of publications in the embedded electronic engineering space. Alix currently lives in Wiesbaden, Germany.

Also check out his YouTube watch-collecting channel, Talking Timepieces.