This series of packaging videos serves as a detailed overview of the semiconductor packaging industry, its history, and its importance in the present and future of integrated circuits as we move into an almost fully digital era.
From dual in-line packaging (DIP) and pin-grid arrays (PGAs) all the way to wafer-level packaging (WLP) and 2.5D and 3D packages like system-in-package (SiP), these forms of packaging revolutionized the semiconductor industry and continue to do so. Advanced packaging provides new means to miniaturize chips, but faster, and with more functionalities, when it seems we are at the end of the Moore’s Law. The entire semiconductor industry now participates in the packaging process with the foundries entering the field and the OSATs (Outsourced Semicondutor Assembly and Test) trying to hold their ground and stay relevant.
This series of videos is a comprehensive crash course about packaging to highlight its importance in the industry, in addition to new trends and technological developments. The aim is to educate and inspire learning the fundamentals of advanced packaging and bring in research individuals from academia, government, and industry to think along potential physical and electrical solutions to provide assurance and security for packages.