Adapters Allow Use Of New Package With Old Footprint

March 1, 2001

These adapters are customized to allow one IC package to replace another no longer available. This includes interconnecting a large through board component with a small surface-mount footprint. The adapter design has been subjected to 1,000 temperature cycles from -55°C to +150°C and to vibration exceeding 40 gs with zero failures. Fine pitch, flexible leadframes are routinely available and good co-planarity is said to be assured. The product shown converts a 22-pin DIP to a 28-pin PLCC, with the option of mounting the DIP device upside down to keep the profile low. The adapter costs less than $10 each/100. There is a further charge of $1.00 if the company were to mount the chip.

Sponsored Recommendations

Highly Integrated 20A Digital Power Module for High Current Applications

March 20, 2024
Renesas latest power module delivers the highest efficiency (up to 94% peak) and fast time-to-market solution in an extremely small footprint. The RRM12120 is ideal for space...

Empowering Innovation: Your Power Partner for Tomorrow's Challenges

March 20, 2024
Discover how innovation, quality, and reliability are embedded into every aspect of Renesas' power products.

Article: Meeting the challenges of power conversion in e-bikes

March 18, 2024
Managing electrical noise in a compact and lightweight vehicle is a perpetual obstacle

Power modules provide high-efficiency conversion between 400V and 800V systems for electric vehicles

March 18, 2024
Porsche, Hyundai and GMC all are converting 400 – 800V today in very different ways. Learn more about how power modules stack up to these discrete designs.

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!