Electronic Design
Adapters Support BGAs Up To 0.4 mm

Adapters Support BGAs Up To 0.4 mm

Expanding the company’s line of Fine Pitch Bump Adapters are components that accommodate boards with pitches down to 0.4 mm. As part of the Correct-A-Chip series, the new adapters allow the use of higher-pitch devices on smaller pitch boards. Their tops have landing pads that can accept any device on any pitch and settle into fine pitch footprints including TSSOP and QFP with pitches down to 0.4 mm. In addition, the adapter’s bottom provides raised connection pads up to 0.25 mm that enable easy mounting of the adapter to the target board. Fine Pitch Bump Adapter boards are 0.813-mm thick FR4 or Rogers 370 HR with 0.5-oz. copper traces on both sides. The non-solder mask defined pads are finished with electroless nickel immersion gold. Price for a Fine Pitch Bump Adapter for a typical application starts at $15 each/100. ARIES ELECTRONICS INC., Bristol, PA. (215) 781-9956.
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