BGA Burn-In Socket Cuts Size By 40%

Oct. 1, 1998
At a size that's about 40% smaller than competitive sockets, the LBA series micro ball-grid array burn-in sockets come in several configurations for Direct Rambus DRAM memory ICs. The socket's small size translates into higher-density burn-in boards,

At a size that's about 40% smaller than competitive sockets, the LBA series micro ball-grid array burn-in sockets come in several configurations for Direct Rambus DRAM memory ICs. The socket's small size translates into higher-density burn-in boards, which in turn means greater productivity and lower burn-in costs. Specifications include contact resistance of 100 milliohms, dielectric withstand of 100 vac, insulation resistance of 1000 milliohms, current rating of 1A, operating temperature of -65°C to 150°C, and operating life of 10,000 cycles.

About the Author

Staff

Articles, galleries, and recent work by members of Electronic Design's editorial staff.

Sponsored Recommendations

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!