EE Product News

BGA Burn-In Socket Cuts Size By 40%

At a size that's about 40% smaller than competitive sockets, the LBA series micro ball-grid array burn-in sockets come in several configurations for Direct Rambus DRAM memory ICs. The socket's small size translates into higher-density burn-in boards, which in turn means greater productivity and lower burn-in costs. Specifications include contact resistance of 100 milliohms, dielectric withstand of 100 vac, insulation resistance of 1000 milliohms, current rating of 1A, operating temperature of -65°C to 150°C, and operating life of 10,000 cycles.

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