EE Product News

BGA Socket Adapter Offers 0.80-mm Pitch

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For high-volume production socketing of ball-grid-array devices, the firm's 0.80-mm pitch SMT Socketing System is its response to customer demands for micro-pitch sockets. The sockets incorporate the firm's eutectic solder ball terminal design and are said to offer an economical and reliable alternative to soldering BGAs directly to boards.Soldering the device to the adapter makes it easily pluggable and provides a dependable approach to BGA upgrade, replacement, repair, test and emulation. The socket's footprint is the same as that of the BGA itself- a wide range of footprints is available. Coplanarity is less than the industry standard of 0.006".

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