EE Product News

BGA Socketing System Designed For Fine-Pitch Packages

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Touted as an economical and reliable alternative to soldering BGA devices directly to the pc board, the 0.75-mm pitch BGA Socket Adapter System is specifically designed for production applications. The BGA socket is the same size as the micro-BGA package, while the adapter is only 2-mm larger. The system enables the BGA device package to be soldered to an adapter, converting it to a pinned device.

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