EE Product News

BGA Systems Offer Three Grid Sizes

The company's BGA socket and adapter systems are now available in three grid sizes, 0.8 mm, 1 mm, and 0.050", and can be used for both socketing BGA devices and interconnecting circuit boards. When socketing a device, the socket is reflow-soldered to the same footprint as the device using solder paste, and the balled device is soldered to a BGA adapter with either flux or paste. A pry-bar tool is available for removing the BGA and its adapter from the socket. For interconnect applications, a PCB adapter is soldered to the daughter card, making it pluggable into a mating socket on the motherboard. Options include having the mounting surfaces of the socket or PCB adapter pre-tinned to replicate solder balls. Prices for the S582-11-025-03-005414 socket and S540-10-025-03-005498 adapter are $12.508 and $12.245 each/100, respectively. MILL-MAX MANUFACTURING CORP., Oyster Bay, NY. (516) 922-6000.


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