BGA Termination Modules Improve System Flexibility

Serving to terminate or re-route signals on a BGA land pattern, ball-grid array (BGA) termination modules allow manufacturers to use one standard motherboard for multiple products. The termination modules have BGA spheres on the bottom side that match the original BGA device footprint. The top side can have terminating devices, re-route traces, and other circuitry as required. Modules can be packaged for compatibility with automated assembly equipment. For greater flexibility, the motherboard can be populated with a HiLo socket that accepts either the BGA device or a BGA termination module without soldering. The BGA termination modules cost from $1.50 each, depending on volume and complexity of design. INTERCONNECT SYSTEMS INC., Camarillo, CA. (805) 482-2870.