The AMK series of multilayer ceramic capacitors (MLCCs) now includes what developer Taiyo Yuden claims is the industry's first 100-µF device housed in an EIA 1206 case size. The 1206 case, which measures 3.2 by 1.6 by 1.6 mm, has a 36% smaller footprint than the previous 1210-sized version. The tiny 100-µF capacitors are well suited for smoothing CPU power circuits.
In addition, the company also claims the first 0.47-µF MLCC in an 0805 case, which measures 2.0 by 1.25 by 1.25 mm. That's a 55% smaller footprint that the previous version, which came in a 1206 package. The 0.47-µF device meets the high-density requirements of cell phones and other small, portable designs.
The size reduction is due to a new material technology that enables fabrication of dielectric layers less than 1 µm thick. Advanced multilayer stacking techniques allowed the integration of more than 600 submicron layers.
The 100- and 47-µF capacitors cost $0.80 and $0.50, respectively. Both are available now. Delivery is two weeks ARO.
Taiyo Yuden (USA) Inc.
www.yuden.us
Small case sizes deliver high capacitance values in the TAJ R series from AVX Corp. The RoHS-compliant (Restrictions on Hazardous Substances) tantalum chip capacitors come in an R case size. Designed for applications with board-level height constraints, the series offers height options of 1.2, 1.5, and 2.0 mm. Capacitance values range from 0.1 to 22 µF with a capacitance tolerance of ±10% to ±20%. Operating temperature ranges from ?55°C to 125°C. The chip capacitors are available on standard 7- or 13-in. reels in quantities of 500 to 10,000. Pricing is about $0.21 each in volume. For additional details, go to www.avxcorp.com.
3M's Embedded Capacitor Material now complies with the Restrictions on Hazardous Substances (RoHS) directive. Used for embedding planar capacitance in circuit boards, the laminate can be made with a dielectric thickness down to 8 µm and a capacitance density over 10 nF/in.2 When used as power and ground layers in a multilayer board, the material effectively becomes a shared decoupling capacitor inside the board, eliminating many discrete capacitors and their associated vias. To learn more, go to www.3M.com/compliant.