Chip-on-board (COB) design and manufacturing methodology is used here to achieve fast modification of existing product designs even where space is at a premium. It is also allows additional functionality to be added within the footprint constraints of existing components, eliminating the need to redesign the product package. Using this methodology, unpackaged silicon die is glued directly onto the surface of an FR4 or flexible PCB substrate and wire bonded to form the electrical connections. An epoxy resin coating is then applied on top of the die to encapsulate and protect it. With additional interface circuitry and interconnection, the resulting daughterboard or module can be customized for mounting in an existing footprint on the main PCB. Other features include efficient heat dissipation and the company can supply modules with elaborate through-board heat sinking to conduct heat directly from the bare die to the exterior of the package.
Company: C-MAC MICROTECHNOLOGY
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