Scoring an industry first, Sonicrimp technology joins similar and dissimilar materials into a gas-tight, moisture-resistant connection without solder, lead, or high temperatures. Solid and stranded wire, cable, flex circuitry, conductive inks, carbon fibers, and headers can be terminated in mass; and connectors can be directly attached to a pc board or substrate. The process employs a polymer cap-and-cradle system that applies high pressure to the connection while sonic energy completes the connection. In addition to eliminating solder-bridging problems and cold-solder joints, the system does away with silver-migration problems associated with applications involving silver polymer thick-film and push-through and ZIF connectors. METHODE ELECTRONICS INC., Chicago, IL. (708) 867-6777.
Company: METHODE ELECTRONICS INC.
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