Cooling And Chassis Technologies Increase Density, Reduce Size

A combination of technologies has been introduced to improve cooling while allowing for higher densities in high-power chassis applications. Said to provide superior cooling and reliability of VME, VXI, cPCI and switch-fabric architectures, Advanced Vector Controlled Air Flow (AVCAF) technology relies on subtle adjustments in airflow direction to improve the balance across system boards without excessive pressure loss. This approach can allow for power dissipation densities up to a factor of four greater in a given enclosure volume. Capable of increasing computing capabilities by as much as 20%, the company's Multi-Node chassis design relies on special interconnect boards that make it possible to integrate a full-size PMC, two external PMC sites, and one embedded PMC/PCI slot in an EIA 1U or sub-1U chassis. The concept consists of a 10U/19" wide rack-mount chassis, subdivided into a computer module section and a power/cooling section. Systems are built in 10U segments, each of which can contain up to 12 computer modules. Multi-Node uses redundant power supplies in an N+1 configuration and a centralized array of fans for cooling. For further information and pricing, call TRACEWELL SYSTEMS, INC., Westerville, OH. (800) 848-4525.