EE Product News

H.110 Backplane Conforms To PICMG 3.0 Specifications

product pic

The 104 CTEL series backplane is designed to meet PICMG 2.0 Revision 3.0 specifications, as well as PICMG 2.5 Rev 1.0. The board features a 12-layer stripline design with integrated hot-swapping capability and 66 MHz operation with up to four peripheral slots and pins reserved for system management functions. In addition, an ATX power connector facilitating easy plug-in from the backplane to the chassis during assembly is included. Other features include power studs for higher power requirements. The backplane is available in 8-, 6-, and 4-slot configurations.

Hide comments


  • Allowed HTML tags: <em> <strong> <blockquote> <br> <p>

Plain text

  • No HTML tags allowed.
  • Web page addresses and e-mail addresses turn into links automatically.
  • Lines and paragraphs break automatically.