Designed to support the growing power demands of next-generation microprocessors, the HC2 family of surface-mount high current power inductors utilizes foil technology and has a compact footprint for high density performance. With a frequency range of 1 kHz to 1 MHz, low DCR/high efficiency, and suitable for IR and vapor reflow soldering, the devices have an ideal design for high current/low voltage applications. Utilizing a foil technology provides the inductors with an added reliability factor for higher frequency circuit designs over more traditional magnet wire normally used. Physically packaged to utilize the maximum power-per-millimeter of pc board space, the devices are suited for higher frequency applications such as desktop and laptop PCs, industrial computer designs, and high-current dc/dc converter applications.
Company: COOPER ELECTRONIC TECHNOLOGIES
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