EE Product News

High-Speed Interface Adds Micro-Pitched Configurations

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The Q-UP line of high-speed interfaces now includes micro-pitched versions for matched impedance applications requiring elevated designs. Board-to-board spacings with the new interfaces are greater than the 16 mm usually required for better thermal dissipation. The interfaces now provide 19-, 22-, 25- and 30-mm board spacings. Surface-mount designs are available on 0.8-mm pitch (QTE series) and 0.5-mm pitch (QTH series). Mixed technology designs on 0.635 mm (MIT series) with through-hole ground plane and surface-mount signal pins are available with 18.75- and 22-mm stack heights. Prices begin at $0.10 to $0.15 per mated line. For more details, call SAMTEC INC., New Albany, IN. (800) 726-8329.

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