EE Product News

Image Analysis Tool Profiles IC Packaging

product pic

Designed for inspecting and verifying boards using BGAs, flip chips, mBGAs, and other high-density packages,image|optimiser 3.1 claims to be viable for determining process defects or performing design analysis for chip and other SMT component packages. Offered as an open system design tool that works with any image file, this new universal image analysis software’s features include live or inverse image analysis, multiple framed window viewing, a range of filters, quick snapshots, text annotation, auto/manual histograms, and user-defined macros.
Additional modules provide wire sweep measurements, die attach analysis, BGA analysis, auto positioning control, and 2-D measurement. Prices start at $9,500 with delivery time from two to four weeks ARO.

Hide comments


  • Allowed HTML tags: <em> <strong> <blockquote> <br> <p>

Plain text

  • No HTML tags allowed.
  • Web page addresses and e-mail addresses turn into links automatically.
  • Lines and paragraphs break automatically.