The company’s layer count reduction (LCR) concept promises significant cost savings without sacrificing performance by reducing the layer count of standard pitch BGA boards by up to 40%. Board thickness is often a mechanical issue in terms of docking height and/or connector requirements. Other approaches used to slim down boards, such as using thinner cores, are limited due to manufacturability and performance. With the company’s design-to-delivery PCB services, it leverages the capabilities of its board fabrication site and the expertise of its design team. MULTITEST ELEKTRONISCHE SYSTEME GmbH, Rosenheim, Germany. +49-(0)8031-406 0.