New Package Holds Bipolar Semiconductors

Designed to hold the firm's bipolar semiconductor dice, ECO-PAC low-profile, isolated-base package has a direct-copper-bonded substrate that helps cool the chips and provides long term reliability and increased load cycling capability. The current terminals are round with conical tips to allow easy insertion into pc boards prior to wave soldering. Package height is 8 mm, which is compatible with other industrial type semiconductor packages. Initial products to be housed in the new package are single- and three-phase rectifier bridges using thyristors, diodes and FREDs. Also available are half-controlled rectifier bridges using thyristors and diodes along with thyristor ac controllers. Current output ratings are 20A to 80A at 600V to 1600V.