Package Combines Thermal Performance Of TO-263 With 8-Pin SOIC Footprint

July 1, 2000
The thermal performance of the much larger TO-263 package is combined with the industry-standard 8-pin SOIC footprint to create the Bottomless package that allows dc/dc converters to meet high-current microprocessor requirements. Package resistance is

The thermal performance of the much larger TO-263 package is combined with the industry-standard 8-pin SOIC footprint to create the Bottomless package that allows dc/dc converters to meet high-current microprocessor requirements. Package resistance is said to be nearly eliminated, allowing for what's claimed as the industry's lowest RDS(ON) in the area of an SO-8. The package eliminated the wire bonds and allows the pc board heat sink to be in direct contact with the solderable backside of the MOSFET die. The package reduces the junction-to-case thermal resistance below 1°C/W. Thermal resistance is further improved by providing heat conduction from both the drain contact on the bottom of the package and the source leads which are thermally well coupled to the MOSFET source. The FDS7064A, the first product in the Bottomless family, has a typical on-resistance of 4.5 milliohms at 4.5 Vgs. Pricing is $0.95 each/10,000.

Company: FAIRCHILD SEMICONDUCTOR

Product URL: Click here for more information

Sponsored Recommendations

Highly Integrated 20A Digital Power Module for High Current Applications

March 20, 2024
Renesas latest power module delivers the highest efficiency (up to 94% peak) and fast time-to-market solution in an extremely small footprint. The RRM12120 is ideal for space...

Empowering Innovation: Your Power Partner for Tomorrow's Challenges

March 20, 2024
Discover how innovation, quality, and reliability are embedded into every aspect of Renesas' power products.

Article: Meeting the challenges of power conversion in e-bikes

March 18, 2024
Managing electrical noise in a compact and lightweight vehicle is a perpetual obstacle

Power modules provide high-efficiency conversion between 400V and 800V systems for electric vehicles

March 18, 2024
Porsche, Hyundai and GMC all are converting 400 – 800V today in very different ways. Learn more about how power modules stack up to these discrete designs.

Comments

To join the conversation, and become an exclusive member of Electronic Design, create an account today!