Package Technology Shrinks RF Power Amp

    June 9, 2003
    Compared with existing approaches to RF integration, Pyxis offers to cut packaging costs in half while lowering package height 60% and reducing footprint by 75%. The first implementation of Pyxis will be a power-amplifier module that integrates...

    Compared with existing approaches to RF integration, Pyxis offers to cut packaging costs in half while lowering package height 60% and reducing footprint by 75%. The first implementation of Pyxis will be a power-amplifier module that integrates triband GSM and GPRS amplifier die with surrounding passives (See the figure).

    Compared with a laminate packaging technology employing discrete passives, which occupies a 90-mm2 footprint, the Pyxis implementation requires just 23 mm2 of board space. Future implementations of Pyxis will address the need to integrate RF transceivers, filters, and switches.

    For more information, contact Catherine de Villeneuve at (408) 952-4342 or mail to: [email protected] or see www.tessera.com/.

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