Packaging & Materials: Ganged Multiport Cages Deliver High Packaging Densities

July 5, 2004

Ganged cages can help free up board space, which in turn enables higher packaging densities. Such is the case with the Molex SFP multiport ganged cages that come in four press-fit versions of 1 by 2, 1 by 4, 1 by 5, and 1 by 6. The rugged metal-cage designs, based on the Small Form Factor Multi Source Agreement (MSA), incorporate a press-fit pin design for ease of use. They feature a compliant 360° gasket and multiple ground pin locations for electromagnetic-interference containment. A 20-pin host connector, copper modules, loopback adapters, short-fault-protection patch assemblies, and HSSDC2 cable assemblies are also available for a total solution package. Price per 100-unit lots ranges from $6.88 to $9.24. Lead time is six weeks.

Molex Inc. www.molex.com (501) 851-4850, ext. 459

About the Author

Roger Allan

Roger Allan is an electronics journalism veteran, and served as Electronic Design's Executive Editor for 15 of those years. He has covered just about every technology beat from semiconductors, components, packaging and power devices, to communications, test and measurement, automotive electronics, robotics, medical electronics, military electronics, robotics, and industrial electronics. His specialties include MEMS and nanoelectronics technologies. He is a contributor to the McGraw Hill Annual Encyclopedia of Science and Technology. He is also a Life Senior Member of the IEEE and holds a BSEE from New York University's School of Engineering and Science. Roger has worked for major electronics magazines besides Electronic Design, including the IEEE Spectrum, Electronics, EDN, Electronic Products, and the British New Scientist. He also has working experience in the electronics industry as a design engineer in filters, power supplies and control systems.

After his retirement from Electronic Design Magazine, He has been extensively contributing articles for Penton’s Electronic Design, Power Electronics Technology, Energy Efficiency and Technology (EE&T) and Microwaves RF Magazine, covering all of the aforementioned electronics segments as well as energy efficiency, harvesting and related technologies. He has also contributed articles to other electronics technology magazines worldwide.

He is a “jack of all trades and a master in leading-edge technologies” like MEMS, nanolectronics, autonomous vehicles, artificial intelligence, military electronics, biometrics, implantable medical devices, and energy harvesting and related technologies.