EE Product News

RJ-45 Makes Better Use Of Space

Addressing the requirements for I/O connectors in ATCA and AMC environments, the company's low-profile RJ45 modular jack is designed to fit on an AMC half height module faceplate with maximum dimensions of 4.2 mm above and 7.38 mm below the printed circuit board. According to the company, the low profile design provides better space utilization by allowing two half-height modules to be packaged in place of a single full-height module. This reportedly doubles the number of I/O connections within the same available space. The jacks are shielded and include panel ground springs for EMI containment. Options include single-port and 1x4 configurations, with and without LEDs. TYCO ELECTRONICS, Harrisburg, PA. (800) 522-6752.


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