EE Product News

Small Patch Boosts Performance Of Larger Circuits

Targeting automotive applications, the Density Patch circuit is claimed to be a low-cost alternative for turning low-density circuits into high-performance assemblies. The circuit is designed for specialized functions such as automotive instrumentation, electrical control units, consoles, and other applications requiring a small number of electrical components to be deployed affordably and efficiently over a larger circuit. Assembled to the user's specifications, the small, high-density circuit is populated on one of the company's flexible circuit-board materials. This pre-tested assembly is then attached to a low-density polyester substrate through a permanent solder connection, allowing the patch to piggyback on a larger and less costly circuit. This is said to eliminate the need to use large volumes of a more expensive material capable of withstanding the heat of the solder process.


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