EE Product News

Tool Applies Solder Paste For Rework

The task of applying solder paste for rework and repair is made easier with the Component Print Station, an easy-to-use device that applies the paste directly onto the part rather than the board, allowing application to be performed on a bench or any convenient work surface. Unlike typical mini-stencil tools, the device's self alignment of the part to the stencil guarantees quick, accurate, and repeatable results. In addition, since paste is applied on the component rather than the board, issues of paste slump during board preheat is said to be eliminated. The device simplifies BGA replacement by allowing the operator to simply insert the replacement component into the print station, close the lid with a single thumbscrew and apply paste.

Hide comments


  • Allowed HTML tags: <em> <strong> <blockquote> <br> <p>

Plain text

  • No HTML tags allowed.
  • Web page addresses and e-mail addresses turn into links automatically.
  • Lines and paragraphs break automatically.