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Nordson Test & Inspection

Sonoscan is the most trusted authority on the application of Acoustic Microscopy, also known as Acoustic Micro Imaging (AMI) technology for nondestructive internal inspection and analysis.
2149 E. Pratt Blvd.
Elk Grove Village, IL 60007
847.437.6400
847.437.1550

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Sonoscan’s C-SAM acoustic microscopes are recognized as the benchmark for accuracy.  You’ll benefit from the unmatched expertise of our dedicated acoustic applications engineers. Our engineers represent the leading minds in AMI and regularly receive industry recognition and awards, including the prestigious IEEE Rayleigh Award.

Customers benefit from a staff of more than 20 dedicated and highly experienced AMI applications engineers—a pool of talent that delivers a remarkable level of knowhow, accuracy, and service that is unsurpassed in the industry. This expertise is available to anyone seeking assistance with failure analysis, component screening or feasibility determinations (compatibility studies).

Articles

Creating an acoustic map with color, via screening through the use of acoustic micro imaging, helps easily locate defects.
Fine internal structural details of a critical component in its original condition can be accessed even after it has vanished or been destroyed.
The TO-247 is a popular electronic form factor, so doing non-destructive analysis of possible structural defects could come in handy during the design process.
Both X-ray and ultrasound make it possible to nondestructively examine the internal structure of solid materials. There is little correlation between their respective abilities...
Structural irregularities in the body of an IGBT module can cause immediate or eventual electrical failure. These irregularities may be detected by three-dimensional acoustic ...
Acoustic imaging of high-voltage ceramic chip capacitors performs a non-destructive cross section through the capacitor—or, since the method is non-destructive, as many cross ...
Before power modules are used in the assembly of a system, it is worthwhile to learn whether the modules contain internal structural defects that could cause the module to fail...

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