Samtec

Samtec releases ultrafine-pitch, high-density edge card

June 18, 2018

New Albany, IN (Newswire.com). Samtec has announced the release of what it calls the industry’s first 0.50-mm-pitch edge-card socket (MEC5) with justification beam. This design meets the demands for decreased size and increased speeds while also optimizing cost, the company said. The socket’s justification beam is designed to shift the card into proper alignment with the contacts, allowing for standard board tolerance on cards that would typically not work with ultrafine-pitch connectors.

The extreme density of this ultrafine 0.50-mm-pitch edge-card socket provides space savings compared to more common 0.80-mm pitch solutions. Available in both vertical (MEC5-DV) and right-angle (MEC5-RA) versions, this socket features up to 300 total I/Os for high-density applications.

In order to meet the industry’s demands for speed, the vertical socket is designed for 28-Gb/s NRZ or 56-Gb/s PAM4 performance. Both orientations are designed to handle PCIe Gen 4 signaling.

“I’m excited to announce the release of the MEC5 edge-card system as it will add another layer to Samtec’s already vast edge-card offering,” said Terry Emerson, high-speed product manager at Samtec. “The ability to use standard board tolerances, on such a tight pitch, is not something currently found in the industry. This will allow our customers to pass high-speed signals through an incredibly dense connector while keeping the mating PCB at a reasonable cost.”

Rated to 1.5 A per contact, this system accepts .062” (1.60-mm) thick cards and features standard alignment pins and card polarization. A choice of through-hole or surface mount rugged weld tabs are available for a secure connection to the board.

https://www.samtec.com/connectors/edge-card/high-speed/micro-edge-card

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RN (editor)

This post was selected and edited by Executive Editor Rick Nelson from a press release or other news source. Send relevant news to [email protected].

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