Using a neural network to learn how layout and patterns will impact the thickness, erosion and dishing of the Pre-CMP data

Key steps to take to ensure you are achieving the best throughput for your IC design

Are you using pattern matching to optimize your layouts?

Discover how CUI’s omniCOOL™ system, found in its line of sleeve bearing axial fans, bridges the gap between traditional sleeve and ball bearing designs, thanks to dramatically reduced fan friction, wobble, and noise.

Learn how CUI’s advanced Peltier module construction technique more effectively addresses the thermal challenges present in today’s board-level electronic applications.

This guide provides a high-level primer on the key steps to take when selecting a heat sink, discussing power dissipation, thermal impedances, important calculation, Thermal Interface Material (TIM), and more.

Learn why 3D printing is a viable production option!

Understanding the 5G New Radio (NR) physical layer is critical as organizations rush to bring 5G technology to market.