Chipset Cuts Out Heatsink in 220-W Resonant Power Converters
Power Integrations also released its HiperLCS-2 chipset designed to simplify the design of LLC resonant power converters. The ICs deliver up to 220 W of continuous output power with no heatsink and at 98% efficiency.
The family features HiperLCS2-HB, a half-bridge power device using its unique 600-V FREDFETs with lossless current sensing and high- and low-side drivers. A separate safety isolation device, HiperLCS2-SR, integrates a synchronous-rectification driver and FluxLink isolated control mechanism. FluxLink technology for digital feedback control offers faster transient response plus better long-term reliability than optocouplers.
This highly integrated architecture eliminates bulky heatsinks and cuts component count by up to 40%, including unreliable optocouplers, compared with discrete designs, while offering up to 98% efficiency, said Power Integrations. The new chips are ideal for use in compact adapters and open-frame power supplies for televisions, consumer goods such as game consoles, as well as chargers for power tools, and electric bicycles.
Power-supply designs based on the HiperLCS-2 ICs can support no-load input power of less than 50 mW at 400-V dc input and deliver a continuously regulated output of up to 220 W, according to Power Integrations.
The HiperLCS-2 family features a self-powered startup and can supply the startup bias for a power-factor-correction (PFC) stage, including those based on the company’s HiperPFS ICs and its HiperPFS-5 PFC devices.
Secondary-side sensing provides less than 1% regulation accuracy across line and load range and production variations. Protection features include undervoltage, output overvoltage, and overtemperature shutdown.