EE Product News

Platform Accelerates Design Of Bluetooth Chips

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The Bluetooth system-on-chip (SoC) integration platform accelerates the design of Bluetooth baseband chips for fabrication in a range of silicon process technologies. The platform integrates the company's low power Bluetooth baseband controller core and protocol stack with its ARM SoC integration platform to generate a Bluetooth baseband SoC solution. Both the integrated SoC platform and the individual intellectual property (IP) components are immediately available through custom design programs or can be licensed independently. This solution enables customers to accelerate the introduction of new Bluetooth-ready products and to rapidly enhance existing products with Bluetooth connectivity. The platform's modular architecture enables the fast integration of IP to add custom options to the company's pre-designed baseband solution. The platform is both a vehicle and a structured methodology for IP selection, integration and verification, which increases project predictability and accelerates time to market. Deliverables include full RTL source, test benches, verification scripts, code coverage scripts, synthesis scripts, example driver layer software, and app notes.

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