A new power amplifier module, in conjunction with several other of the company's chips, is said to form the most complete and highly integrated CDMA chipset available. The module, the PA3100, employs an advanced GaAs HBT process.
The PA3100 series comes in three versions: the PA3100 -2 for the 824-849 MHZ cellular band; the PA3100-3 for the 1850-1910 MHz PCS band; and the PA-3100-3K for the 1750-1780 MHz PCS band. All three versions contain corresponding frequency band impedance matching, optimized for power, efficiency and linearity. They are internally matched to 50 ohm input and output, permitting "drop and place" design. All come in a compact 6 mm x 6 mm land-grid-array style package. Call for pricing.