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Ideas for Design Vol. 3, No. 5 (Download)

Feb. 16, 2023
Download the PDF of this issue that presents two ideas: an approach to cutting product size in half via PCB technology and a way to simplify MCU command parsing with text encoding.

This article is part of the Ideas for Design Series: Volume 3

The Volume 3, No. 5 issue of Ideas for Design features:

  • An approach to shrink product sizes by 50% by using advanced via technology to combine two conventional eight-layer cards into a single 18-layer HDI card.
  • A way to implement a much-more efficient parsing scheme by converting the text into two-letter pairs using a simple encoding table, and representing each by a 16-bit number. 

This link is to the article, while the Download button provides access to the PDF of the article:


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