SEMI issues SEMICON West call for papers

Jan. 24, 2015

SEMI has announced a call for papers for SEMICON West to be held July 14-16 in San Francisco. The call applies to the event’s Semiconductor Technology Symposium and the TechXPOT programs. Presentation abstracts are due March 20, 2015.

SEMICON West 2015 will be attended by nearly 27,000 semiconductor and related microelectronics industry professionals and will feature more than 60 hours of technical sessions. For 2015, SEMICON West will feature two Generation Next pavilions—a new concept in topic-based engagement, which will connect exhibits, technical sessions, and networking events to current, critical industry topics, engaging exhibitors and visitors in an immersive exhibition experience. In addition, the standing-room-only success of the SEMICON West TechXPOT programs prompted the creation of the Semiconductor Technology Symposium (STS) at the 2014 event.

In 2015, the STS program continues with programs on leading-edge chip manufacturing held in a classroom setting with reserved seating adjacent to the show floor in the North Hall of the Moscone Center. STS will offer technology trends, developments, and new technology information in the areas of advanced materials and processing, lithography, metrology, 450 mm, advanced packaging, and 3D-IC. Test Vision 2020, the leading semiconductor test conference focusing on ATE and high-volume manufacturing, is part of the STS program in the Moscone Center.

TechXPOT programs in the Moscone Center North and South Halls will continue focusing on special topics in semiconductor manufacturing, and adjacent and related microelectronics technologies.

For the Semiconductor Technology Symposium, TechXPOTs, and Generation Next, SEMI is soliciting technical presentations in the following areas:

  • advanced lithography/advanced films,
  • advanced materials and processes,
  • contamination control for advanced materials,
  • new and advanced metrology solutions,
  • interconnect challenges at sub-10-nm,
  • substrates,
  • other process implications for manufacturing next-generation transistors,
  • accelerating and improving yield,
  • silicon photonics,
  • disruptive compound semiconductor technologies,
  • manufacturing advanced power semiconductors,
  • improving yield on nonplanar ICs,
  • failure analysis,
  • advanced packaging,
  • design for packaging,
  • semiconductor test,
  • design for test,
  • application level testing,
  • technologies for emerging markets and applications,
  • MEMS,
  • manufacturing of IoT devices,
  • 3-D printing,
  • printed and flexible electronics,
  • sensors,
  • SiP for power and RF, and
  • heterogeneous integration for SiP and modules.

“There are many exciting challenges facing the industry today,” said Karen Savala, president of SEMI Americas. “We are pleased that SEMICON West continues to serve as the premier forum where industry leaders share their insight on these issues.”

Prospective presenters are invited to submit abstracts (maximum 500 words) on key industry issues and topics in the areas listed above for consideration. Presentations should focus on the latest developments and innovations in these technology areas, inclusive of supporting data. Submissions may be made online at The deadline is March 20.

The two new Generation Next Pavilions will be held in conjunction with technical sessions (STS and TechXPOTs) at SEMICON West—addressing critical issues, challenges, and opportunities. For more information about exhibiting opportunities within these new Pavilions, contact Nick Antonopoulos at [email protected].

SEMI will host its 3rd Annual Silicon Innovation Forum at SEMICON West 2015 and is now accepting early applications to participate. The Silicon Innovation Forum (SIF) provides a stage for new and emerging innovators, industry leaders, strategic investors, and venture capitalists to discuss the needs and requirements of the industry’s innovation engine. Participants will gain insights into technology, capital, partnership, and collaboration strategies necessary for mutual success. For more information, please email Ray Morgan, director of outreach at [email protected]. The deadline is March 20.

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