This webinar was originally held on April 19th, 2024, and is now available for on demand viewing.
Duration: 1 hour
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Summary
SWaP-C, Size, Weight and Power and Cost is the mantra for rugged, military and avionic applications. Thermal management affects all of these. Thermal design is becoming more important as things like artificial intelligence and machine learning push the performance envelope.
The challenge of cooling high performance CPUs, FPGAs and GPUs in electronic systems deployed in harsh military environments is met with a range of thermal management techniques. Figuring out which approach gives the best SWaP-C solution can be a challenge.
This presentation will provide an introduction and overview of cooling options available to system designers, including conduction, air-flow-through and liquid-flow-through technologies.
Speakers
Ivan Straznicky
CTO Advanced Packaging
Curtiss-Wright Defense Solutions
Ivan Straznicky, P.Eng. is CTO Advanced Packaging and a Technical Fellow at Curtiss-Wright Defense Solutions, Ottawa, Ontario, Canada. He received his Bachelor of Mechanical Engineering from McGill University and is a Certified Advanced Technology Manager. His responsibilities include the entire scope of advanced packaging technologies for the company’s products. Ivan has over 30 years of experience in the defense and aerospace industry in manufacturing, engineering, technology, and management.
William Wong
Senior Content Director
Electronic Design
Bill is the Editor of Electronic Design and has over forty years of experience as an engineer and author. He has been with Electronic Design for over twenty years covering the electronics industry.
He earned a Bachelors of Electrical Engineering from The Georgia Institute of Technology and an Masters in Computer Science from Rutgers University.
