Semiconductor wafers are cut from cylindrical silicon crystals, or ingots and the flatness of these disc-shaped wafers must be tightly controlled. These tight tolerances are needed to ensure that the entire wafer surface is suitable for integrated circuit (IC) production. This process includes steps like lapping and polishing, thin film deposition, and lithography.
This article delves into the semiconductor wafer production and why out-of-spec wafers are costly mistakes that can be avoided. It is even possible to reprocess a wafer that does not meet specifications. Of course, this means having an efficient and effective inspection process.
This article explains why disc geometry matters at each step in wafer processing – and what can go wrong.
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