Semiconductor Wafer Measurement for Increased Productivity

March 14, 2024
This article describes how manufacturers leverage capacitance-based inspection systems for semiconductor wafers. The article reviews best-practices, consequences of failing to inspect semiconductor wafers and benefits ofwafer metrology systems.

Semiconductor wafers are cut from cylindrical silicon crystals, or ingots. The flatness of these disc-shaped wafers is controlled to tight tolerances to ensure that the entire wafer surface is suitable for integrated circuit (IC) production. If disc geometry is out-of-spec after cutting, it may be possible to reprocess the wafer. Cutting is only the first step in wafer processing, and subsequent steps such as lapping and polishing, thin film deposition, and lithography can add costs if a wafer fails dimensional specifications. This article explains why disc geometry matters at each step in wafer processing – and what can go wrong.


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