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July 14, 2012. Advantest at Semicon West highlighted the development of a new product line of fully automated and integrated test and handling solutions for TSV-based 2.5-D and 3-D products. The company's concept model test cell, dubbed DIMENSION, integrates a high parallel test cluster along with singulated die and 3D die stack automated handling capabilities.
2.5-D and 3-D-stack technologies offer improvements to density, power, and performance. The primary concerns of this emerging architecture are delicate and thin die handling, active thermal management, and overall yield management. The DIMENSION concept addresses these issues, says Advantest, with SmartDieCarrier (SmtDCTM) technology. SmtDCTM solutions provide die pick & place plus very fine pitch contact with both extreme precision and delicate soft-touch handling. and active thermal control (ATC) with real-time power management achieves yield and specification compliance. Adding confident yield to the 3-D equation the Dimension concept enables stacked device commodity, Advantest reports.
Wide I/O DRAM
The JEDEC Wide I/O Mobile DRAM provides 8X the bandwidth with 1/4 to 1/2 the I/O power of conventional DRAM architectures. But today’s market also demands highest yields with commodity class economy. Wide I/O DRAM and future 3-D TSV heterogeneous devices will depend on KGS and superb productivity. The DIMENSION concept demonstrates KGD and KGS solutions for smart phones and tablets of tomorrow as well as the telecom routers and super computing CPUs now under development.
www.advantestexpo2012.jp/en-index.html
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