Keysight Technologies today announced the development of a STT-MRAM test solution based on collaboration with the Tohoku University Center for Innovative Integrated Electronic Systems (CIES) STT-MRAM activities. The solution is designed for testing STT-MRAM (spin-transfer torque magnetoresistive random-access memory) devices that are used in super-low-power electronic systems, such as electronic appliances, where it is necessary to reduce carbon emissions.
“We are delighted that our collaborative research has resulted in a successful outcome with Keysight and believe it will contribute to further advancements in STT-MRAM research worldwide,” said Prof. Tetsuo Endoh, professor of the Graduate School of Engineering, Tohoku University, and director of the Center for Innovative Integrated Electronic Systems. “As one of seven areas of focus for the CIES research consortium, our goal is to create innovative core technologies for substantial energy savings in integrated electronic devices. This R&D project of the STT-MRAM is intended to develop nonvolatile working memory for manufacturing technologies that will contribute to super-low-power electronic systems, which is crucial for a low-carbon society with low-power electronic appliances.”
“As the result of work with Tohoku University, Center for Integrated Electronic Systems, Keysight will launch the STT-MRAM test solution in early 2016,” said Masaki Yamamoto, vice president and general manager of Keysight’s Hachioji Semiconductor Test Division. “Our collaboration with CIES is key for us to develop the STT-MRAM test solution that addresses the various challenges facing the industry’s need for low-power electronic systems.”
The Center for Innovative Integrated Electronic Systems (CIES) was established as the first research base of Science Park at Tohoku University’s Aobayama new campus in October 2012. The center was created to research the innovative integrated electronic systems with energy-saving technologies, utilizing the various basic research seeds of Tohoku University, and the centripetal force of academic-industrial collaboration experiences. In Japanese universities, CIES was the first research center to have a 300-mm wafer process line and characterization tools that are compatible for industry’s R&D labs. CIES is supplying the collaboration base for open innovations between Tohoku University and companies of many materials, tools, devices and systems using leading-edge facilities. Contact [email protected] for additional information.
