First 65nm sample chips

Munich, Germany: Infineon announced it has produced first sample chips in its 65nm lowpower and high-performance CMOS platform technology. Infineon leveraged the results of the industry 65nm/45nm alliance, which composes IBM, Chartered, Infineon, and Samsung (ICIS). Wafer production was done in the frame of the manufacturing partnership with Chartered. As an early mover to the 65nm lowpower version within the ICIS alliance, Infineon demonstrates 65nm readiness to all advanced logic programs and offers turnkey solutions to designers working in power-sensitive applications.