Electronic ID welcomes paper-thin smart-card ICs

Eindhoven, The Netherlands: Ultra-thin smart-card ICs finer than a human hair, or a sheet of paper. Such chips, part of NXP Semiconductors’ SmartMX family, can now be manufactured at 75 m (0.000075 m) thickness. That’s 50% thinner than the current industry standard for smart-card ICs.

As a result, product designs like NXP’s new MOB6 contactless chip package can deliver enhanced security features and durability to address the latest requirements for electronic identification documents. Among the applications are such documents as ePassports, eVisas, and national ID cards.