Novel Liquid-Cooled Rack Integrates NVIDIA HGX B300 Platform

ASRock Rack aims to lower temperatures for AI-based industries in collaboration with ZutaCore and its HyperCool waterless system.
Oct. 16, 2025
2 min read

What you'll learn:

  • Insight into ASRock Rack's latest servers with integrated liquid- and air-cooled solutions.
  • Why the servers excel for AI-based factories and high-performance computing.
  • Other ASRock solutions for industry-based platforms.

The 4U16X-GNR2/ZC server, launched by ASRock Rack at this year's OCP Global Summit 2025, integrates NVIDIA's HGX B300 platform, which packs eight NVIDIA Blackwell Ultra GPUs that feature high-speed interconnects, with ZutaCore's HyperCool waterless liquid-cooling system.

Designed for artificial-intelligence (AI) factories and high-performance computing, the system uses a non-conductive dielectric fluid to wick heat from chips, eliminating the need for traditional water-based cooling. This result delivers improved thermal management, safety, and sustainability while reducing energy and operational costs.

"AI at scale requires infrastructure that not only accelerates deployment, but also drives greater energy efficiency to meet today's sustainability goals," said Weishi Sa, President of ASRock Rack. "The NVIDIA HGX B300 platform sets a new benchmark for accelerated computing, enabling transformative AI performance across industries.

He added, “With the 4U16X-GNR2/ZC, ASRock Rack is delivering the world's first platform to feature NVIDIA HGX B300 with a waterless liquid-cooling system designed for high-performance, energy-efficient AI operations. This innovation addresses critical thermal challenges while enabling data centers to scale efficiently, safely, and sustainably."

ASRock Rack is also unveiling an air-cooled 8U16X-GNR2 (also built on the NVIDIA HGX B300 platform) and the 4UXGM-GNR2 CX8, which incorporates NVIDIA RTX PRO 6000 Blackwell GPUs, ConnectX-8 SuperNICs, and BlueField-3 DPUs for AI inference and visual computing. Furthermore, the company is showcasing its 4OU12N-AM5 OCP server, powered by AMD EPYC 4005, aimed at cloud-hosting environments.

Open Compute Project
promo_ocp__open_compute_project
Check out technology on display at the Open Compute Project summit.

About the Author

Cabe Atwell

Technology Editor, Electronic Design

Cabe is a Technology Editor for Electronic Design. 

Engineer, Machinist, Maker, Writer. A graduate Electrical Engineer actively plying his expertise in the industry and at his company, Gunhead. When not designing/building, he creates a steady torrent of projects and content in the media world. Many of his projects and articles are online at element14 & SolidSmack, industry-focused work at EETimes & EDN, and offbeat articles at Make Magazine. Currently, you can find him hosting webinars and contributing to Electronic Design and Machine Design.

Cabe is an electrical engineer, design consultant and author with 25 years’ experience. His most recent book is “Essential 555 IC: Design, Configure, and Create Clever Circuits

Cabe writes the Engineering on Friday blog on Electronic Design. 

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